Call for industrial systems and software product lines papers

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For more than a decade, organizations have been taking advantage of systems and software product line practices to achieve business advantages in time to market, cost, quality, and agility. They have encountered a wide range of challenges, successes, and adaptations in their systems and software product line experience. In addition, more and more organizations are opening up products and platforms to external contributions, to leverage the innovation power and network effects of software ecosystems.
We are seeking contributions from industry that share their challenges, successes, and adaptations of existing practices in all stages of maturity.


  • Abstract submission:  Mar 10, 2017 Mar 17, 2017  (extended)
  • Paper submission: Mar 17, 2017 Mar 24, 2017  (extended)
  • Notification: May 10, 2017
  • Camera-ready papers:  June 5, 2017 Jun 22, 2017


We solicit papers on the following areas and topics (but not limited to):
  • Introducing PLE to an organization
  • Software ecosystems in industry context
  • Business ecosystems around product line engineering
  • Process issues, e.g. combining PLE with DevOps and agile practices
  • Scoping of product/solution portfolios and assets
  • Principled approaches to product line and software ecosystems architectures, design, and assessment
  • Variability management in and between all stages of the life-cycle
  • Addressing quality attributes in PLE and software ecosystems
  • Guidance and governance PLE tools and methods
  • Product line testing, validation, version and configuration management
  • Disruptive innovations and its effects on software product line
  • Novel applications of product line concepts (e.g. Cyber Physical Systems, Industry 4.0, IoT or Cloud Computing)
  • Full papers reporting experience from industrial applications and projects. The papers in this category must provide sufficient context of the problems identified or addressed, describe clear requirements and/or experience in solving them, provide an assessment of benefits and drawbacks or other lessons learned, and explain why the contribution is innovative or valuable for others.
  • Short papers describing, from an industrial perspective, early returns on new product line and software ecosystem applications and projects, or other shorter industry topics of interest. 

The page limit is 10 pages for full papers and 5 pages for short papers. Submissions must follow the ACM proceedings format and will be reviewed by at least three members of the Industrial systems and software product lines track program committee following high scientific standards.

The ACM styles have changed recently, and all authors should use the official 2017 ACM Master article template.

Latex users are indicated to use the “sigconf” option, so they are recommended to use the template that can be found in “sample-sigconf.tex”. In this way, the following latex code can be placed at the start of the latex document:


acmConference[SPLC'17]{21st International Conference on Software Product Line}{25--29 September, 2017}{Seville, Spain}
The SPLC proceedings will be published in the ACM Digital Library. SPLC is ranked as a top conference.
At least one author of each accepted submission must register and attend SPLC 2017 in order for the submission to be published.
Submissions should be sent using EasyChair:
  • Lidia Fuentes,Universidad de Málaga
  • Daniel Schall, Siemens Corporate Technology